G+T has advised next-generation semiconductor company Syenta on its USD26 million Series A financing, led by Playground Global and Australia’s National Reconstruction Fund (NRF), as the company moves to commercialise its advanced packaging technology and expand into the United States.
The round also saw participation from existing investors Investible, Salus Ventures, Jelix Ventures and Wollemi Capital, taking Syenta’s total funding to date to more than USD36 million. This new capital positions Syenta to accelerate the commercialisation and prepare for high-volume production at a time when demand for AI and high-performance computing is intensifying.
Syenta is developing proprietary Localized Electrochemical Manufacturing (LEM) technology, which is designed to improve AI system performance by enabling high-density chip-to-chip connections. The technology addresses growing constraints in advanced packaging, a critical bottleneck as demand for AI and high-performance computing continues to accelerate.As part of the raise, Pat Gelsinger, General Partner at Playground Global, will join Syenta’s board.
G+T advised Syenta on the structuring and execution of this financing round, working closely with the company and its investors through to completion.
The G+T team was led by partner Xavier Keary, with support from lawyers Henry Simpson and Omar Harduwar.
Xavier Keary said:
Syenta is at the forefront of innovation in semiconductor packaging, addressing a key constraint in the evolution of AI and high-performance computing. We are pleased to support the company on this important milestone as it scales its technology globally.
